Price: £293.88 - £259.98
Last Updated: Apr 12, 2023 11:54:04 UTC
From the manufacturer
ASUS is one of Fortune magazine’s World’s Most Admired Companies and is one of the top motherboard and gaming brands as well as a top-three consumer notebook vendor. ASUS is driven by passion and innovation and dedicated to creating quality products for a future smart life, designing and manufacturing products that perfectly meet the needs of today’s digital home, office and person. Our wide portfolio includes MG248Q, Chromebox and a range of devices and components, along with AR and VR
PRIME X670-P WIFI
ASUS PRIME X670-P WIFI, an AMD X670 Ryzen AM5 ATX motherboard with three M.2 slots, DDR5, USB 3.2 Gen 2×2 Type-C, USB4 support, WiFi 6 and 2.5Gb Ethernet
AMD AM5 socket: Ready for AMD Ryzen 7000 Series Desktop Processors Enhanced power solution: 12+2 DrMOS, 6-layer PCB, ProCool connectors, alloy chokes and durable capacitors for stable power delivery Ultrafast connectivity: Wi-Fi 6, M.2 PCIe 5.0, Realtek 2.5Gb Ethernet, USB 3.2 Gen 2×2 Type-C, front panel USB 3.2 Gen 1 Type-C, USB4 header support ASUS OptiMem II: Careful routing of traces and vias, plus ground layer optimizations to preserve signal integrity for improved memory overclocking Comprehensive cooling: Large VRM heatsinks, M.2 heatsink, Passive Chipset Heatsink, hybrid fan headers and Fan Xpert 4 with AI Cooling II Outshine RGB Aura Effect: Stylish edge lighting design, Addressable Gen 2 headers and Aura RGB headers support
PCIe 4.0 Slot
Prime X670 motherboards offer PCIe 4.0 connectivity for the latest GPUs. The wide bandwidth and superfast transmission speeds allow you to create feature-rich builds that can handle high loads effortlessly.
PCIe 5.0 M.2 Support
PRIME X670-P WIFI offers a total of three M.2 slots, the first one supports data-transfer speeds of up to 128Gbps via PCIe 5.0, enabling quicker boot-up and app load times with OS or application drives.
*Actual transmission speeds will be lower than the theoretical maximum speed.
M.2 Heatsink
An M.2 heatsink takes care of the M.2 slot, warding off throttling that can occur with M.2 storage during sustained transfers.
Removable captive screws reduce risk of drops or loss during heatsink removal.
VRM Heatsinks and High-quality Thermal Pads
Two massive VRM heatsinks and high-quality thermal pads improve heat transfer from the MOSFETs and chokes for better cooling performance.
Robust Power Design
Stable power is essential to extract every last bit of performance out of AMD processors. The PRIME X670-P WIFI is geared to cater to the demands of these high-core-count CPUs.
1. ProCool Connectors
Proprietary connectors augment the motherboard’s link to the PSU with 4 pin+8 pin connectors that pass 12 volts of power directly to the processors. Each jack features solid pins that can handle more current than hollow-pin connectors.
2. 12+2 DrMOS Power Stages
12+2 DrMOS power stages combine high-side and low-side MOSFETS and drivers into packages rated for 60 amperes each, delivering power, efficiency, stability and performance to current and future AMD processors.
USB 3.2 Gen 2×2 Type-C
A batch of USB ports support high-end rigs loaded with peripherals, including both front and rear USB Type-C connectors with ultrafast USB 3.2 Gen 2×2 for transmission speeds of up to 20Gbps.
WIFI 6E
The WiFi 6 module is compatible with the 802.11ax standard and pushes theoretical peak bandwidth up to an incredible 1.2Gbps. Perhaps more importantly for power users, it’s optimized for more efficient operation on crowded networks with a lot of competing traffic. Pair your motherboard with ASUS WiFi 6 routers to fully experience the networking potential of WiFi 6
*Actual speed varies, and depends on networking conditions.
Q-Latch
The innovative Q-Latch makes it easy to install or remove an M.2 SSD without the need for specific tools. The design employs a simple locking mechanism to secure the drive and neatly eliminate traditional screws.
BIOS FlashBack
The innovative Q-Latch makes it easy to install or remove an M.2 SSD without the need for specific tools. The design employs a simple locking mechanism to secure the drive and neatly eliminate traditional screws.
CPU
AMD Ryzen 7000-series processors AMD Ryzen 7000-series processors AMD Ryzen 7000-series processors
CPU power
12 + 2 (60A) 12 + 2 (60A) 14 + 2 (70A)
Memory
4 x DIMM, Max. 128GB, DDR5 6400+(OC) 4 x DIMM, Max. 128GB, DDR5 6400+(OC) 4 x DIMM, Max. 128GB, DDR5 6400+(OC)
Graphics Output
1 x DisplayPort 1 x HDMI 1 x DisplayPort 1 x HDMI 1 x DisplayPort 1 x HDMI
Expansion slots
1 x PCIe 4.0 x16 (supports x16 mode) 2 x PCIe 4.0 x16 (support x4 mode) 1 x PCIe 3.0 x1 1 x PCIe 4.0 x16 (supports x16 mode) 2 x PCIe 4.0 x16 (support x4 mode) 1 x PCIe 3.0 x1 1 x PCIe 5.0 x16 1 x PCIe 4.0 x16 Slot (max @x4) 1 x PCIe 4.0 x4
M.2
1 x M.2 2280 (PCIe 5.0 x4 mode) 1 x M.2 22110 (PCIe 4.0 x4 mode) 1 x M.2 2280 (PCIe 4.0 x4 mode) 1 x M.2 2280 (PCIe 5.0 x4 mode) 1 x M.2 22110 (PCIe 4.0 x4 mode) 1 x M.2 2280 (PCIe 4.0 x4 mode) 1 x M.2 2280 (PCIe 5.0 x4 mode) 2 x M.2 2280 (PCIe 4.0 x4 mode) 1 x M.2 22110 (PCIe 3.0 x4 & SATA modes)
USB
1 x USB 3.2 Gen 2×2 port (1 x USB Type-C) 3 x USB 3.2 Gen 2 ports (3 x Type-A) 4 x USB 3.2 Gen 1 ports (4 x Type-A) 2 x USB 2.0 ports (2 x Type-A) 1 x USB 3.2 Gen 2×2 port (1 x USB Type-C) 3 x USB 3.2 Gen 2 ports (3 x Type-A) 4 x USB 3.2 Gen 1 ports (4 x Type-A) 2 x USB 2.0 ports (2 x Type-A) 1 x USB 3.2 Gen 2×2 port (1 x USB Type-C) 4 x USB 3.2 Gen 2 ports (3 x Type-A + 1 x USB Type-C) 5 x USB 3.2 Gen 1 ports (4 x Type-A + 1 x USB Type-C)
Gigabit Ethernet
1 x Realtek 2.5Gb Ethernet 1 x Realtek 2.5Gb Ethernet 1 x Realtek 2.5Gb Ethernet
Wireless
Wi-Fi 6 1 x V-M.2 slot (Key E) Wi-Fi 6
SATA 6Gb/s
6 6 4
Upgraded Power Supply 12+2 DrMOS, 6-layer board, ProCool connectors, alloy coils and durable capacitors for stable power supply
Ultra-fast connectivity: Wi-Fi 6, M.2 PCIe 5.0, Realtek 2.5 GB Ethernet, USB 3.2 Gen 2×2 Type-C, front panel USB 3.2 Gen 1 Type-C, USB4 header support
ASUS OptiMem II: precise tracking and through-contacts, as well as optimisation of mass layers to maintain signal integrity for improved memory overclocking
Comprehensive Cooling: Large VRM Heatsink, M.2 Heatsink, Passive Chipset Heatsink, Hybrid Fan Header and Fan Xpert 4 with AI Cooling II
